PN Type Package Designator Pb-Free Packages - Manufacturing Conversion Datecode, Refer to Note 1 Type of Plating / Finish Matte Tin Annealing Process Minimum Plating Thickness Does this Microchip Pb-free device meet RoHS compliance for the following 6 materials: Pb, Hg, Cr6+, Cd, and PBB / PBDE Total Mass (g) STANDARD3L SOT-23 0502Matte Tin150C / 1hr w/l 24 hours400 microinchesYes0.0083
TCM809TENB713 |
RFQ for TCM809TENB713 |
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| Technical/Catalog Information | TCM809TENB713 |
| Vendor | Microchip Technology |
| Category | Integrated Circuits (ICs) |
| Output | Push-Pull, Totem Pole |
| Reset | Active Low |
| Package / Case | SOT-23B-3 |
| Packaging | Tape & Reel (TR) |
| Number of Voltages Monitored | 1 |
| Reset Timeout | 140 ms Minimum |
| Type | Simple Reset/Power-On Reset |
| Voltage - Threshold | 3.08V |
| Operating Temperature | -40°C ~ 85°C |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | TCM809TENB713 TCM809TENB713 TCM809TENB713TR ND TCM809TENB713TRND TCM809TENB713TR |
| Product | Manufacturers | Pack | D/C | ||||||||
| TCM809TENB713 | - | - | - |